MECHANIC XGSP50 Sn63/Pb67 BGA Solder Paste

Features:

Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
Good soldering and welding tool

Specification:

Material: Plastic+solder paste
Type: XGSP50
Alloy: Sn63/Pb37
Microns: 25-45um

Application:

Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.

Package:

10 x MECHANIC XGSP50 Solder Paste